JPH0523291Y2 - - Google Patents

Info

Publication number
JPH0523291Y2
JPH0523291Y2 JP1987188284U JP18828487U JPH0523291Y2 JP H0523291 Y2 JPH0523291 Y2 JP H0523291Y2 JP 1987188284 U JP1987188284 U JP 1987188284U JP 18828487 U JP18828487 U JP 18828487U JP H0523291 Y2 JPH0523291 Y2 JP H0523291Y2
Authority
JP
Japan
Prior art keywords
wafer
wafers
loading
elevator
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987188284U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0191509U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987188284U priority Critical patent/JPH0523291Y2/ja
Publication of JPH0191509U publication Critical patent/JPH0191509U/ja
Application granted granted Critical
Publication of JPH0523291Y2 publication Critical patent/JPH0523291Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Feeding Of Workpieces (AREA)
JP1987188284U 1987-12-11 1987-12-11 Expired - Lifetime JPH0523291Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987188284U JPH0523291Y2 (en]) 1987-12-11 1987-12-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987188284U JPH0523291Y2 (en]) 1987-12-11 1987-12-11

Publications (2)

Publication Number Publication Date
JPH0191509U JPH0191509U (en]) 1989-06-15
JPH0523291Y2 true JPH0523291Y2 (en]) 1993-06-15

Family

ID=31479386

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987188284U Expired - Lifetime JPH0523291Y2 (en]) 1987-12-11 1987-12-11

Country Status (1)

Country Link
JP (1) JPH0523291Y2 (en])

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2688623B2 (ja) * 1992-05-11 1997-12-10 株式会社ディスコ ダイシング装置
JPH10270389A (ja) * 1997-03-21 1998-10-09 Seiko Seiki Co Ltd ダイシング装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5534426A (en) * 1978-08-31 1980-03-11 Toshiba Corp Wafer dicing device
JPS60214911A (ja) * 1985-03-11 1985-10-28 株式会社日立製作所 ダイシング装置

Also Published As

Publication number Publication date
JPH0191509U (en]) 1989-06-15

Similar Documents

Publication Publication Date Title
EP0761387B1 (en) Polishing apparatus
EP1338384B1 (en) Polishing apparatus
US20070004316A1 (en) Integrated system for processing semiconductor wafers
JP2001135603A (ja) 入力モジュールを使用して半導体基板を搬送する方法および装置
JP5179928B2 (ja) ウエーハの搬出方法
JPS5978538A (ja) ダイボンダ装置
JPH0523291Y2 (en])
JPH0647220B2 (ja) ダイシング装置におけるワ−ク搬送方法及び装置
JP3367065B2 (ja) ダイシング装置におけるワーク搬送装置
JP3275299B2 (ja) ダイシング装置及び切断刃のドレッシング方法
JP4295469B2 (ja) 研磨方法
JPH1024449A (ja) ゲートカット部処理システム
JP7294872B2 (ja) 加工装置
JPS62124866A (ja) 研磨装置
JP4074118B2 (ja) 研磨装置
JPH0679153U (ja) ダイシング装置
JP2001358093A (ja) 切断機
JP2997766B2 (ja) ダイシング装置
KR20040103935A (ko) 반도체 기판 처리용 통합 시스템
CN109994406B (zh) 切削装置
JP2518118Y2 (ja) ワーク自動供給・取出用中継ユニット
JPH05315444A (ja) ダイシング装置
JP2007088157A (ja) 切削装置
JP2003077872A (ja) 半導体ウェハ研磨装置及び研磨方法
JP2893628B2 (ja) ダイシング装置